The 2rd International Conference on Financial Management and Economic Transition
About FMET 2022

point8_7s.pngFull Paper Submission Date: August 26, 2022

point8_7s.pngNotification of Acceptance Date: 7 working days for submission

point8_7s.pngRegistration Deadline: August 26-28, 2022

point8_7s.pngFinal Paper Submission Date: August 26, 2022

point8_7s.pngConference Date: August 26-28, 2022

point8_7s.pngVenue: Shenzhen, China

As a leading role in the global megatrend of scientific innovation, China has been creating a more and more open environment for scientific innovation, increasing the depth and breadth of academic cooperation, and building a community of innovation that benefits all. Such endeavors are making new contributions to the globalization and creating a community of shared future.

To adapt to this changing world and China's fast development in the new era, the 2022 International Academic Exchange Conference on Science and Technology Innovation is to be held in December 2022. Organized jointly by over ten universities and academic societies, this conference takes "bringing together global wisdom in scientific innovation to promote high-quality development" as the theme and focuses on cutting-edge research fields including information technology, artificial intelligence, biomedicine, big data, and new energy and new materials. This conference aims to boost development of the Greater Bay Area, expand channels of international academic exchange in science and technology, build a sharing platform of academic resources, promote scientific innovation on the global scale, strengthen academic cooperation between China and the outside world, enhance development of new energy and materials and IT, AI, and biomedicine industries. It also aims to encourage exchange of information on frontiers of research in different areas, connect the most advanced academic resources in China and the world, turn research results into industrial solutions, and bring together talents, technologies and capital to boost development. 

AEIC Series of Conferences